Skip to main content

Published Review Articles

Click on the title of an article to view article highlights.

In this article, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps along with new results of subcooled flow boiling of water through a micropin-fin array heat sink with outlet pressure below atmospheric are presented. Water is one of the most attractive coolants used in flow boiling experiments because of its large-specific heat and latent heat of vaporization, which enables the absorption of considerable amount of heat during both sensible heating and boiling. However, saturation temperature of water at atmospheric pressure is 100 °C, which may be unacceptably high for continuous operation of complementary metal oxide semiconductor (CMOS) electronic devices.

Citation:

Han X, Fedorov A, Joshi Y. Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems. ASME. J. Electron. Packag. 2016;138(4):040801-040801-12. doi:10.1115/1.4034317.

Article Link

Citation:

Nakayama W. Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management. ASME. J. Electron. Packag. 2016;139(1):010801-010801-22. doi:10.1115/1.4035019.

Article Link

Citation:

Zhao D, Qian X, Gu X, Jajja S, Yang R. Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials. ASME. J. Electron. Packag. 2016;():. doi:10.1115/1.4034605.

Article Link

Citation:

Lau JH. Recent Advances and New Trends in Flip Chip Technology. ASME. J. Electron. Packag. 2016;138(3):030802-030802-23. doi:10.1115/1.4034037.

Article Link

Citation:

Mukherjee S, Nuhi M, Dasgupta A, Modarres M. Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies. ASME. J. Electron. Packag.2016;138(3):030801-030801-13. doi:10.1115/1.4033375.

Article Link