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Published Review Articles

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Citation:

Panigrahy A K, Chen K-N. Low Temperature Cu–Cu Bonding Technology in Three Dimensional Integration: An Extensive Review. ASME. J. Electron. Packag. MARCH 2018, Vol. 140 / 010801-1. [DOI: 10.1115/1.4038392]

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Gao Y, Cheng H. Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration. ASME. J. Electron. Packag. 2017;139(2):020801-020801-16. doi:10.1115/1.4036238.

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Citation:

Zhang H, Hedge A. Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices. ASME. J. Electron. Packag. 2017;139(3):030802-030802-9. doi:10.1115/1.4037146.

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Rahim K, Mian A. A Review on Laser Processing in Electronic and MEMS Packaging. ASME. J. Electron. Packag. 2017;139(3):030801-030801-11. doi:10.1115/1.4036239.

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Citation:

Han B, Kim D. Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review. ASME. J. Electron. Packag. 2017;139(1):010802-010802-11. doi:10.1115/1.4035598.

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