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Published Review Articles

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Citation:

Gao Y, Cheng H. Assembly of Heterogeneous Materials for Biology and Electronics: From Bio-Inspiration to Bio-Integration. ASME. J. Electron. Packag. 2017;139(2):020801-020801-16. doi:10.1115/1.4036238.

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Citation:

Rahim K, Mian A. A Review on Laser Processing in Electronic and MEMS Packaging. ASME. J. Electron. Packag. 2017;139(3):030801-030801-11. doi:10.1115/1.4036239.

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Citation:

Zhang H, Hedge A. Overview of Human Thermal Responses to Warm Surfaces of Electronic Devices. ASME. J. Electron. Packag. 2017;139(3):030802-030802-9. doi:10.1115/1.4037146.

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Citation:

Han B, Kim D. Moisture Ingress, Behavior, and Prediction Inside Semiconductor Packaging: A Review. ASME. J. Electron. Packag. 2017;139(1):010802-010802-11. doi:10.1115/1.4035598.

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In this article, a review of fundamental experimental studies on flow boiling in plain and surface enhanced microgaps along with new results of subcooled flow boiling of water through a micropin-fin array heat sink with outlet pressure below atmospheric are presented. Water is one of the most attractive coolants used in flow boiling experiments because of its large-specific heat and latent heat of vaporization, which enables the absorption of considerable amount of heat during both sensible heating and boiling. However, saturation temperature of water at atmospheric pressure is 100 °C, which may be unacceptably high for continuous operation of complementary metal oxide semiconductor (CMOS) electronic devices.

Citation:

Han X, Fedorov A, Joshi Y. Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems. ASME. J. Electron. Packag. 2016;138(4):040801-040801-12. doi:10.1115/1.4034317.

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