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Published Review Articles

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Citation:

Nakayama W. Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management. ASME. J. Electron. Packag. 2016;139(1):010801-010801-22. doi:10.1115/1.4035019.

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Citation:

Zhao D, Qian X, Gu X, Jajja S, Yang R. Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials. ASME. J. Electron. Packag. 2016;():. doi:10.1115/1.4034605.

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Citation:

Lau JH. Recent Advances and New Trends in Flip Chip Technology. ASME. J. Electron. Packag. 2016;138(3):030802-030802-23. doi:10.1115/1.4034037.

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Mukherjee S, Nuhi M, Dasgupta A, Modarres M. Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies. ASME. J. Electron. Packag.2016;138(3):030801-030801-13. doi:10.1115/1.4033375.

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Citation:

Xie B, Hu R, Luo X. Quantum Dots-Converted Light-Emitting Diodes Packaging for Lighting and Display: Status and Perspectives. ASME. J. Electron. Packag. 2016;138(2):020803-020803-13. doi:10.1115/1.4033143.

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