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Published Review Articles

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Citation:

Siow KS, Lin YT. Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study. ASME. J. Electron. Packag. 2016;138(2):020804-020804-13. doi:10.1115/1.4033069.

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Citation:

Uzunlar E, Schwartz J, Phillips O, Kohl PA. Decomposable and Template Polymers: Fundamentals and Applications. ASME. J. Electron. Packag.2016;138(2):020802-020802-15. doi:10.1115/1.4033000.

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Citation:

Wang Y, Li Z, Xiao J. Stretchable Thin Film Materials: Fabrication, Application, and Mechanics. ASME. J. Electron. Packag. 2016;138(2):020801-020801-22. doi:10.1115/1.4032984.

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Bar-Cohen A, Matin K, Narumanchi S. Nanothermal Interface Materials: Technology Review and Recent Results. ASME. J. Electron. Packag. 2015;137(4):040803-040803-17. doi:10.1115/1.4031602.

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Citation:

Green C, Kottke P, Han X, et al., “A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration”, ASME. J. Electron. Packag. 2015;137(4):040802-040802-9. doi:10.1115/1.4031481.

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