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Published Review Articles

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Citation:

Alkharabsheh S, Fernandes J, Gebrehiwot B, et al. A Brief Overview of Recent Developments in Thermal Management in Data Centers. ASME. J. Electron. Packag. 2015;137(4):040801-040801-19. doi:10.1115/1.4031326.

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Citation:

Bar-Cohen A, Matin K, Jankowski N, Sharar D. Two-Phase Thermal Ground Planes: Technology Development and Parametric Results. ASME. J. Electron. Packag. 2014;137(1):010801-010801-9. doi:10.1115/1.4028890.

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Citation:

Lau JH. Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration. ASME. J. Electron. Packag.2014;136(4):040801-040801-15. doi:10.1115/1.4028629.

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