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These articles are soon to be published by the ASME Journal of Electronic Packaging:

  • Evolution of hardware morphology of large-scale computers and the trend of space allocation for thermal, Toru Ikeda (Kagoshima University), Wataru Nakayama (ThermTech International)
  • Overview of human thermal responses to warm surfaces of electronic devices, Zhang, Hedge
  • Moisture Ingress, Behavior and Prediction Inside Semiconductor Packaging, Changsoo Jang (Apple) , Bongtae Han (University of Maryland)