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September 2016 - ASE's Picks - Selected Papers:

The following are selected articles from recent issues of the Journal of Electronic Packaging which is of significant relevance to industry. The JEP Editorial Board extends its appreciation to Dr. Yi-Shao Lai of Advanced Semiconductor Engineering who selected these papers as a service to our readers. The ASE Group is the world’s largest provider of independent semiconductor manufacturing services in assembly and test. The group develops and offers complete turnkey solutions covering IC packaging, design and production of interconnect materials, front-end engineering test, wafer probing and final test, as well as electronic manufacturing services through USI, Inc. As global leader, ASE provides a complete scope of services for the semiconductor market, driven by superior technologies, breakthrough innovations, and advanced development programs.

  1. Benchmarking study on the thermal management landscape for three-dimensional integrated circuits: From back-side to volumetric heat removal, Thomas Brunschwiler, Arvind Sridhar, Chin Lee Ong, Gerd Schlottig, J. Electron. Packag. 2016; 138(1):010911. doi:10.1115/1.4032492
  2. Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study, K. S. Siow, Y. T. Lin, J. Electron. Packag. 2016; 138(2):020804. doi:10.1115/1.4033069
  3. Nanothermal Interface Materials: Technology Review and Recent Results, Avram Bar-Cohen, Kaiser Matin, Sreekant Narumanchi, J. Electron. Packag. 2015; 137(4):040803. doi:10.1115/1.4031602
  4. Review and projections of integrated cooling systems for three-dimensional integrated circuits, Satish G. Kandlikar, J. Electron. Packag. 2014; 136(2):024001. doi:10.1115/1.4027175
  5. Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne, J. Electron. Packag. 2016; 138(1):010902. doi:10.1115/1.4032346
  6. Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications, Erdal Uzunlar, Paul A. Kohl, J. Electron. Packag. 2015; 137(4):041001. doi:10.1115/1.4030952
  7. Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study, Soud Farhan Choudhury, Leila Ladani, J. Electron. Packag. 2015; 137(4):041003. doi:10.1115/1.4031523
  8. Structural size effect on mechanical behavior of intermetallic material in solder joints: Experimental investigation, Leila Ladani, Ousama Abdelhadi, J. Electron. Packag. 2014; 137(1):014501. doi:10.1115/1.4027992
  9. Simplifying Reliability Testing of Wire Bonds Using On-Chip Heater and Pad Resistance Method, S. Kim, M. Mayer, J. Persic, J. T. Moon, J. Electron. Packag. 2014; 137(1):011002. doi:10.1115/1.4028281

June 2016 - IBM's Picks - Selected Papers:

The following are selected articles from recent issues of the Journal of Electronic Packaging which is of significant relevance to industry. The JEP Editorial Board extends its appreciation to Dr. Thomas Brunschwiler IBM Corporation who selected these papers as a service to our readers.

  1. Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components, Benjamin Giron-Palomares, Xin Fu, Abel Hernandez-Guerrero and Bladimir RamosAlvarado, J. Electron. Packag. 2014;136(3):031008-031008-8. doi:10.1115/1.4027378.
  2. Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor, Vivek Sahu, Andrei G. Fedorov and Yogendra K. Joshi,. J. Electron. Packag. 2014;136(3):031014-031014-8. doi:10.1115/1.4027901.
  3. Two-Phase Thermal Ground Planes: Technology Development and Parametric Results FREE TO VIEW, Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski and Darin Sharar, J. Electron. Packag. 2014;137(1):010801-010801-9. doi:10.1115/1.4028890.
  4. Analysis of Using Ferrofluid as an Interface Material in a Field Reversible Thermal Connector, Ahmed S. Yousif and Gary L. Solbrekken, J. Electron. Packag. 2015;137(2):021003-021003-9. doi:10.1115/1.4028958
  5. Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections, Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki and Hideo Miura, J. Electron. Packag. 2015;137(3):031001-031001-8. doi:10.1115/1.4029931.
  6. Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages, Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos and Eric Beyne, J. Electron. Packag. 2016;138(1):010902-010902-10. doi:10.1115/1.4032346.
  7. Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities, Tom Saenen and John R. Thome, J. Electron. Packag. 2016;138(1):010901-010901-13. doi:10.1115/1.4032490
  8. Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study, K. S. Siow and Y. T. Lin, J. Electron. Packag. 2016;138(2):020804-020804-13. doi:10.1115/1.4033069.

October 2015 - Intel's Picks - Selected Papers

The following are selected articles from recent issues of the Journal of Electronic Packaging which is of significant relevance to industry. The JEP Editorial Board extends its appreciation to Chandra Mohan M. Jha, Nachiket R. Raravikar, and Eric J. Li of Intel Corporation who selected these papers as a service to our readers.

  1. Thermal Cycling Study of Quilt Packaging”, M. Ashraf Khan, Quanling Zheng, David Kopp, Wayne Buckhanan, Jason M. Kulick, Patrick Fay, Alfred M. Kriman and Gary H. Bernstein, Journal of Electronic Packaging, vol. 137, issue 2.
  2. On chip power generation using ultrathin thermoelectric generators” Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay and Satish Kumar, Journal of Electronic Packaging,  vol 137, issue 1
  3. Design of Thermoelectric modules for high heat flux cooling” Ram Ranjan, Joseph E. Turney, Charles E. Lents and Virginia H. Faustino, Journal of Electronic Packaging, vol 136, issue 4
  4. Enhanced electrical and thermal interconnects by the self-assembly of nanoparticle necks utilizing capillary bridging” Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher and Heiko Wolf, Journal of Electronic Packaging,  vol 136, issue 4
  5. Effect of through-silicon-via joule heating on device performance for low-powered mobile applications by Fahad Mirza ,Gaurang Naware, Ankur Jain and Dereje Agonafer, Journal of Electronic Packaging, Vol. 136, issue 4
  6. Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors”, Richard C. Jaeger, Mohammad Motalab, Safina Hussain and Jeffrey C. Suhling, Journal of Electronic Packaging, vol 136, issue 4.
  7. "Reliability-based design guidance of three-dimensional integrated circuits packaging using thermal compression bonding and dummy Cu/Ni/SnAg microbumps” Chang-Chun Lee and Po Ting Lin, Journal of Electronic Packaging,  Vol. 136, issue 3
  8. High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux”, Fuliang Wang, Junhui Li and Lei Han, Journal of Electronic Packaging, vol 136, issue 3.