The following review articles will appear in future JEP issues:
Assembly of heterogeneous materials from bio-inspirational to bio-integration, Gao, Cheng
MEMS and Information and Storage - Ahsan Mian (Montana State University) and Golam Newaz (Wayne State University)
Electro-dynamic Vibration Testing and Repetitive Shock Vibration Testing for Electronic Assemblies, Abhijit Dasgupta, (University of Maryland)
LED Packaging, Ricky Lee (HKUST)
A Review of the Functional Requirements, Design Approaches, and Emerging Technologies for Applications of Thermal Interface Materials- Craig Green, Thomas Bougher, Mathew Smith, and Baratunde Cola (Georgia Institute of Technology)
Shock Survivability of Electronic Systems, Pradeep Lall (Auburn University)
Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-side Economizer, Shah
Prognostics Health Management of Electronic Systems, Pradeep Lall (Auburn University)
Packaging Technology for Latest Power Semiconductor Module, Yoshikazu Takahashi (Fuji Electric Co.)
Atomic Layer Deposition and Molecular Layer Deposition for Packaging, Ryan J. Lewis and Y. C. Lee (University of Colorado)
Adhesion Testing for Interfaces of Multi-Layer Semiconductor Packaging Structures: A Review, Kenny Mahan and Bongtae Han (University of Maryland)
High Temperature and Harsh Environment technical committee, David Shaddock (GE Global Research)
Alternate Air Movers for Electronic Cooling: Advances and Challenges, Anandaroop Bhattacharya (IIT Kharagpur), Rakshit Tirumala (GE Global Research), Peter de Bock (GE Global Research)
Thermal management of Small Form Factor Electronics, Anandaroop Bhattacharya (IIT Kharagpur), Mark Macdonald (Intel Corp.)
Electronics packaging for very high G force loadings- Louis Manzione (Bell labs)
