The following review articles will appear in future JEP issues:
- Assembly of heterogeneous materials from bio-inspirational to bio-integration, Gao, Cheng
- MEMS and Information and Storage - Ahsan Mian (Montana State University) and Golam Newaz (Wayne State University)
- Electro-dynamic Vibration Testing and Repetitive Shock Vibration Testing for Electronic Assemblies, Abhijit Dasgupta, (University of Maryland)
- LED Packaging, Ricky Lee (HKUST)
- A Review of the Functional Requirements, Design Approaches, and Emerging Technologies for Applications of Thermal Interface Materials- Craig Green, Thomas Bougher, Mathew Smith, and Baratunde Cola (Georgia Institute of Technology)
- Shock Survivability of Electronic Systems, Pradeep Lall (Auburn University)
- Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-side Economizer, Shah
- Prognostics Health Management of Electronic Systems, Pradeep Lall (Auburn University)
- Packaging Technology for Latest Power Semiconductor Module, Yoshikazu Takahashi (Fuji Electric Co.)
- Atomic Layer Deposition and Molecular Layer Deposition for Packaging, Ryan J. Lewis and Y. C. Lee (University of Colorado)
- Adhesion Testing for Interfaces of Multi-Layer Semiconductor Packaging Structures: A Review, Kenny Mahan and Bongtae Han (University of Maryland)
- High Temperature and Harsh Environment technical committee, David Shaddock (GE Global Research)
- Alternate Air Movers for Electronic Cooling: Advances and Challenges, Anandaroop Bhattacharya (IIT Kharagpur), Rakshit Tirumala (GE Global Research), Peter de Bock (GE Global Research)
- Thermal management of Small Form Factor Electronics, Anandaroop Bhattacharya (IIT Kharagpur), Mark Macdonald (Intel Corp.)
- Electronics packaging for very high G force loadings- Louis Manzione (Bell labs)