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Contact the Editor or Staff

Editor

Y.C. Lee, S.J. Archuleta Professor

Department of Mechanical Engineering

University of Colorado, Boulder, CO 80309, U.S.A.

Editor of ASME Journal of Electronic Packaging

E: leeyc@colorado.edu

P: 1(303)-492-3393

Assistant to the Editor

Kaixin (Kai) Cui

Department of Mechanical Engineering

University of Colorado, Boulder, CO 80309, U.S.A.

E: kaixin.cui@colorado.edu

P: 303-396-4769

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