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October 2018

ASE has managed to achieve as high as 99% yield rates in the final test stage for its FOPLP process indicating significant progress in the fan-out panel-level packaging services in the first half of 2019. The Fan-out panel level packaging is considered as a cost-effective next generation highly integrated IC packaging technology. The company is looking to take a leap forward in its FOPLP business development in the first half of 2019.