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Date
October 2018

Ansys announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology. The certifications and validations are vital for fabless semiconductor companies that require their simulation tools to pass rigorous testing and validation for new process nodes and packaging technologies. The General Manager at said that ANSYS semiconductor solutions address complex multi-physics challenges such as power, thermal, reliability and impact of process variation on product performance. He also added that ANSYS’ comprehensive Chip Package System solutions for chip aware system and system aware chip signoff help mutual customers accelerate design convergence with greater confidence.