Opvius and Cambrios Advanced Materials have successfully developed semi-transparent organic photovoltaic (OPV) modules featuring a silver nanowire (AgNW) bottom electrode. The effectiveness of OPV modules on Cambrios' nanowire-coated substrate has been demonstrated before but this is the first time that this type of combination of technologies has been applied to free-form modules. State-of-the-art multilayer bottom electrodes on plastic substrates are manufactured using large machinery to apply sputtering processes that require a high-vacuum environment. Compulsory long pumping times combined with substrate films which only allow a certain temperature budget result in higher cost of manufacturing.
IBM claims that some improvements in the copper deposition will give a major boost to the use of copper interconnects in the CMOS, where other options are being considered to replace copper. Prominent option being graphene, fails to flow uniformly and can’t achieve the low resistances of enhanced copper interconnects. Copper with a thin cap of cobalt is better than graphene at carrying current and even at the smallest sizes imaginable for copper interconnects, are still the best solution.
The research team at KAIST has developed an ultra-flexible organic flash memory that is bendable down to a radius of 300um. The solution processing used for the preparation of most of the polymeric dielectric layers also makes it difficult to use them in flash memory due to the complexity involved in the formation of the bilayer dielectric structure, which is the key to flash memory operations.
The rising demand for electronic systems in cars, with increasing attention focused on self-driving (autonomous) vehicles, vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications, can more than compensate for the consistent decline of semiconductor sales in PCs. As a result, automotive IC sales are expected to increase by 22 percent in 2017 and another 16 percent next year. The compounded growth includes increases in robotics, wearable health devices and systems promoting the Internet of Things help drive growth in this segment.
A new development is underway to use MEMS chips as biosensors in human bodies. These chips are to be used for assisted and automated driving. bioMEMS, biosensors and piezoelectric MEMS that can run almost without batteries are speculated to be in development phase. The MEMS packaging industry is expected to grow at 16.7% CAGR to nearly $7 billion in 2022.