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Tech Updates

Advanced testing paradigm shifting in era of heterogeneous integration
Date
January 2019

SEMI Taiwan Testing Committee founded to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications. As the number of chips integrated in a single package increases, the structural complexity also rises. Not only will this make identifying chip defects harder, but the compatibility and interconnection between components will also introduce uncertainties that can undermine the reliability of the final ICs. The traditional notion of design for testing, an approach that enhances testing controllability and observability, is now coupled with the imperative to test for design, which emphasizes drawing analytics insights from collected test data to help reduce design errors and shorten development cycles.

Quantum Dots to Shrink MicroLED Display Pixels
Date
January 2019
Source

Nanoco Technologies and Plessey Semiconductors have partnered to shrink the pixel size of monolithic microLED displays using Nanoco’s cadmium-free quantum-dot (CFQD quantum dots) semiconductor nanoparticle technology. It will integrate the CFQD quantum dots into selected regions of blue LED wafers to add red and green light, shrinking the smallest practical pixel size from today’s 30 µm to 4 µm, a reduction of 87%.The process will enable the production of smaller, higher-resolution microLED displays in applications such as AR/VR devices, watches, and mobile devices while enhancing both color rendition and energy efficiency.

 

Date
January 2019
Source

Huawei announced a 7-nm Arm-based server CPU that it claims outperforms rivals and servers using it. The Kunpeng 920 shows the increasing sophistication of China’s largest system vendor and chip designer at a time when it’s at the center of heated trade tensions with the U.S. The Kunpeng 920 packs 64 custom Arm-v8 cores running at 2.6 GHz. It supports eight DDR4 channels running up to 2,933 MT/s, two 100G Ethernet ports, and PCIe Gen 4.

Date
December 2018

MagnaChip Semiconductor Corporation offers foundry customers its third generation 0.18 micron Bipolar-CMOS-DMOS (BCD) process technology. The technology is highly suitable for PMIC, DC-DC converters, battery charger ICs, protection ICs, motor driver ICs, LED driver ICs and audio amplifiers. The third generation 0.18 micron BCD process technology offers improved specific on-resistance (Rsp) of power LDMOS that operates up to 40V with simplified manufacturing steps. The third generation BCD process technology offers various optional devices to enhance design integration and flexibility. 

Development of MEMS sensor chip equipped with ultra-high quality diamond cantilevers
Date
December 2018

A NIMS-led research group succeeded in developing a high-quality diamond cantilever with among the highest quality (Q) factor values at room temperature ever achieved. The group also succeeded for the first time in the world in developing a single crystal diamond microelectromechanical systems (MEMS) sensor chip that can be actuated and sensed by electrical signals. The research group subsequently developed a new technique enabling atomic-scale etching of diamond surfaces. This etching technique allowed the group to remove defects on the bottom surface of the single crystal diamond cantilever fabricated using the smart cut method.