Skip to main content

Welcome to!

Electronic packaging integrates components into a microsystem or system; its design and manufacturing activities represent about 50% of all activities required to make a system hardware, e.g. a smartphone or data center. This is a companion web site of the ASME Journal of Electronic Packaging (JEP), which serves as a bridge between researchers in academia and professionals in industry conducting R&D studies for system integration. From this web site you can get latest information about the journal’s publications and free downloads of review articles on hot, emerging and fundamental topics. In addition, you will be able to access other information to enhance technical exchange. You are welcome to join our LinkedIn and interact with the JEP community.

LinkedIn Join Button


Or, you will be informed with updates by clicking here to send an email to us to be included in our email database.