Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as well as new performance-leading CPUs for the latest blade servers have literally been made possible by these remarkable IC package constructions. These cutting-edge technologies are leading the way for incredible advancements. Moreover, they all have a common characteristic: high-speed, high-performance ICs.