New research from Future Facilities - maker of the 6SigmaET thermal simulation software - has revealed the top design priorities of leading thermal engineers in the IT equipment industry in 2019. The research was derived from a digital roundtable event which brought together thermal designers, engineers and experts from leading brands including, Facebook, HP Enterprise, QuantaCool, Engineered Fluids, CommScope, Vertiv, 6SigmaET and Binghamton University.
Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. What follows are excerpts of that conversation.
Making biochips, a key technology in studying disease, just got a little easier. This new nanoprinting process uses gold-plated pyramids, an LED light, and photochemical reactions to print more organic material on the surface of one single biochip than ever before. This nanoprinting process allows researchers to 3D print more material on a biochip than ever before, making it easier to study biomedical issues. This process likely known as tip-based lithography, are widely considered to be the best way to 3D print organic material with nanoscale feature resolution. They’re using microfluidics, the manipulation of fluids on a molecular level, to expose each biochip to the desired combination of chemicals.
The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools in the in-line production flow, but it also now requires new die sorting equipment with advanced inspection capabilities. Die sorters are not the kind of equipment that typically attracts attention. For years, this technology has worked well enough to cruise well under the radar.
Heterogeneous integrated circuit (IC) packaging has made a full entrance into the high-performance computing arena. The target applications are broad, running the gamut from artificial intelligence (AI), deep learning, data center networking, supercomputers, and autonomous driving. In fact, a new generation of deep learning AI, leading central processing units (CPUs) for data center servers as well as new performance-leading CPUs for the latest blade servers have literally been made possible by these remarkable IC package constructions. These cutting-edge technologies are leading the way for incredible advancements. Moreover, they all have a common characteristic: high-speed, high-performance ICs.